ሁሉም ምድቦች

ድርብ ወለል ላፕሊንግ ማሽነሪ ማሽን

እዚህ ነህ : መነሻ ›ምርቶች>ትክክለኛነት መጎተት/መጥረግ ማሽን ተከታታይ>ድርብ ወለል ላፕሊንግ ማሽነሪ ማሽን

Polishing-Machine
ድርብ ወለል መጥረጊያ ላፕቶፕ ማሽን YH2M13B-9L

ድርብ ወለል መጥረጊያ ላፕቶፕ ማሽን YH2M13B-9L


This equipment is mainly used for lapping and polishing both sides of the parallel surface of thin metal and hard brittle nonmetal parts, such as silicon, sapphire crystal, ceramic, optical glass, quartz crystal and other semiconductor materials.

ጥያቄ
ቴክኒካዊ ቁምፊዎች

ቴክኒካዊ ባህሪዎች
● The machine is according to four planetary gears motion principle.
● This machine adopts the way of the inner gear ring lifting. The cylinder pushes spiral cam to drive the ring gear lift when it ups and downs. It is controlled by a three manual valve device which is installed in the right side. The gear ring can be adjusted.
● Double motor driving. The main motor drives the upper lapping plate, the lower lapping plate and the inner gear ring to rotate by a series of variable speed, And the sunwheel is driven by the auxiliary motor. Both the main motor and the auxiliary motor are frequency conversion. The lower lapping plate, inner ring gear and the sun wheel rotate in the same direction, but the upper lapping plate opposite.
● The machine is equipped with safety lock cylinder, when the upper lapping rises to the up limitation, the inserting plate comes out to prevent it falling down so that ensure the operator and equipment safety.
● PLC control is flexible and reliable.
● It adopts touch screen as man-machine interface device, which displays the alarm and in real time information of machine status, it is very friendly and with large amount of information.

የማመልከቻ ጉዳይ
The device can be processed workpiece including silicon, sapphire crystal, ceramic, optical glass, quartz crystal and other semiconductor materials., etc.

የአፈጻጸም

ዝርዝር

ንጥል

YH2M13B-9L

Lapping plate size(OD* ID*TH)

φ978xφ558x45mm

የፕላኔቶች ጎማ ዝርዝር

DP=12 ዜድ=108

 Planetary Wheel Qty

3≤n≤9

The max workpiece size

200mm              (Rectangle diagonal 200mm)

The min THK

0.4mm

Lapping workpiece flatness

≤0.008 ሚሜ(φ200)

Polishing workpiece flatness

≤0.005 ሚሜ(φ200)

Lapping workpiece roughness

≤ራ0.15μm

Polishing workpiece roughness

≤ራ0.125μm

መጠን (L * W * H)

1650x1300x2650mm

ሚዛን

2600kg


ሌሎች ምድቦች ፡፡
    ጥያቄ